Course Information
SemesterCourse Unit CodeCourse Unit TitleT+P+LCreditNumber of ECTS CreditsLast Updated Date
2EEE514Integrated Circuit Technology II3+0+03616.06.2026

 
Course Details
Language of Instruction English
Level of Course Unit Master's Degree
Department / Program ELECTRICAL AND ELECTRONICS ENGINEERING
Type of Program Formal Education
Type of Course Unit Elective
Course Delivery Method Face To Face
Objectives of the Course This course aims to provide advanced knowledge of modern integrated circuit fabrication technologies, process integration, and emerging semiconductor manufacturing techniques. Students will gain a comprehensive understanding of advanced CMOS technologies, nanometer-scale fabrication processes, process optimization, reliability issues, and future trends in integrated circuit manufacturing.
Course Content Advanced semiconductor manufacturing technologies; process integration for deep submicron and nanoscale CMOS; advanced oxidation and diffusion processes; ion implantation and annealing techniques; thin-film deposition technologies (CVD, PVD, ALD); advanced lithography methods including EUV lithography; plasma etching and surface engineering; interconnect technologies and metallization; process variability and yield enhancement; reliability and failure mechanisms; semiconductor process characterization techniques; FinFET and Gate-All-Around technologies; 3D integrated circuits; MEMS-compatible fabrication processes; emerging semiconductor technologies and future manufacturing trends.
Course Methods and Techniques Face to face
Prerequisites and co-requisities None
Course Coordinator Prof.Dr. Nuran DOĞRU
Name of Lecturers Prof.Dr. NURAN DOĞRU
Assistants None
Work Placement(s) No

Recommended or Required Reading
Resources Silicon VLSI Technology – James D. Plummer, Michael D. Deal, Peter B. Griffin.
Fundamentals of Modern VLSI Devices – Yuan Taur and Tak H. Ning.

Course Category
Mathematics and Basic Sciences %10
Engineering %90

Planned Learning Activities and Teaching Methods
Activities are given in detail in the section of "Assessment Methods and Criteria" and "Workload Calculation"

Assessment Methods and Criteria
In-Term Studies Quantity Percentage
Mid-terms 2 % 60
Final examination 1 % 40
Total
3
% 100

 
ECTS Allocated Based on Student Workload
Activities Quantity Duration Total Work Load
Weekly lecture hours 14 3 42
Presentation preparation 1 5 5
Presentation 1 2 2
Midterm and midterm exam preparation 2 15 30
Final exam and preparation for the final exam 1 35 35
Other (Specify) 14 4 56
Total Work Load   Number of ECTS Credits 6 170

 
Course Learning Outcomes: Upon the successful completion of this course, students will be able to:
NoLearning Outcomes
1 Analyze advanced semiconductor fabrication processes used in modern IC manufacturing.
2 Evaluate process integration strategies in nanometer CMOS technologies.
3 Explain advanced lithography techniques and their technological limitations.
4 Assess the impact of process variations on device performance and yield.
5 Analyze reliability challenges in advanced integrated circuits.
6 Apply process simulation and characterization methods to semiconductor technologies.
7 Compare conventional CMOS technologies with emerging device technologies.
8 Conduct independent research on advanced semiconductor manufacturing topics.
9 Interpret scientific literature related to integrated circuit technology.
10 Develop innovative solutions for semiconductor process engineering problems.

 
Weekly Detailed Course Contents
WeekTopicsStudy MaterialsMaterials
1 Review of Advanced Semiconductor Processing Fundamentals
2 Process Integration in Modern CMOS Technologies
3 Advanced Oxidation, Diffusion and Annealing Processes
4 Ion Implantation and Dopant Engineering
5 Thin Film Deposition: CVD, PVD and ALD
6 Advanced Lithography Techniques and EUV Lithography
7 1st midterm
8 Plasma Processing and Dry Etching Technologies
9 Metallization and Interconnect Technologies
10 Process Variability and Yield Enhancement
11 Reliability Issues in Integrated Circuits
12 FinFET and Gate-All-Around Device Fabrication
13 2nd midterm
14 3D Integration and Advanced Packaging Technologies, Emerging Semiconductor Technologies

 
Contribution of Learning Outcomes to Programme Outcomes
P1 P2 P3 P4
All 5 5 4 4
C1 5 5 4 4
C2 5 5 4 4
C3 5 5 4 4
C4 5 5 4 4
C5 5 5 4 4
C6 5 5 4 4
C7 5 5 4 4
C8 5 5 4 4
C9 5 5 4 4
C10 5 5 4 4

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  https://obs.gantep.edu.tr/oibs/bologna/progCourseDetails.aspx?curCourse=147970&lang=en